Wrisley Abrasives provides a wide variety of precision Diamond and CBN wheels specifically engineered for customers’ applications. Each wheel is designed to grind hard materials freely while maximizing diamond life.
• OD Slicing Wheels
• ID Slicing Wheels
• Edging / Centering / Beveling Wheels
• Thin Dicing Wheels
• Centerless Grinding Wheels
• Profile Wheels
• Surface Grinding Wheels
• Other Wheel Shapes
• Continuous rim wheel diameters up to 22”
• Kerf thickness as thin as .004”
• Kerf thickness tolerance as tight as +/-.0001”
• Precision flanges available
ELECTROPLATED DIAMOND WIRE
Secured diamond saw wire is designed for environmentally-friendly thin kerf wafer sawing without the use of slurries. Our customers use SDS wire for sawing brittle materials that are normally difficult to cut. Diamond wire, with its fine micron diamond particles, produces an outstanding surface finish to the material and maintains excellent flatness control, while performing at three to four times the through cut speed of slurry cutting. Sizes range from 180 micron through 350 micron. Sawing with diamond wire has proven beneficial with the following materials: Silicon, Quartz/Glass, Sapphire, Germanium, Single, Crystal Silicon Carbide, Galium Nirtate, Cadmiun Zinc Telluride (CTZ), Indium Tin Oxide, and Green or Fired Ceramics.
ELECTROPLATED DIAMOND BANDSAW BLADES
Wrisley Abrasives provides customers with the highest quality diamond bandsaw blades at an affordable price and fast delivery. Our bandsaw blades have specially formulated steel backing providing both beam strength and flexibility, with high quality diamond grit electroplated to the edge. Bands are cut and welded to customer specifications and the welds are guaranteed to last the life of the blade. Our customers benefit from precise cutting, minimal material loss, and a reduction in band replacement costs from the superior band life.